NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC17XS6500CEK
Package Description:    ESOIC 32 7.5*11*2.4
Tracking Number:   K00184D051


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Aluminum    RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
Lead Frame Plating    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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