NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC17XSF500EKR2
Package Description:    ESOIC 32 7.5*11*2.4
Tracking Number:   K00184D006


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Bonding Wire    RoHS CoA
Bonding Wire, Aluminum    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
Lead Frame Plating    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request