NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC33972ATEW
Package Description:    EXPOSED PAD 4.7*4.7MM


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame  AG SPOT PLATE  RoHS CoA
  CDA 194  RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request