NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC33FS6522NAE
Package Description:    48LQFP 7x7x1.4Ep 4.5x4.5
Tracking Number:   K00147D046


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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