NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC68908GR16MFJE
Package Description:    LQFP 32 7*7*1.4P0.8
Tracking Number:   K10949D195


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request