NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC9S08AC32CPUE
Package Description:    LQFP 64 10*10*1.4P0.5
Tracking Number:   K11060D032


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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