NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC9S08AW32CFDER
Package Description:    QFN 48 EP 7*7*1.0P0.5


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame  AG PLATING  RoHS CoA
  C194  RoHS CoA
    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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