NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC9S08AW32VFGE
Package Description:    LQFP 44 10*10*1.4P0.8
Tracking Number:   K11060D037


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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