NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC9S08PA4AVDC
Package Description:    DFN 8 3X3X1 P0.65 EP
Tracking Number:   K10949D391


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Other    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Lead Frame Plating    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request