NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC9S08QA2CFQE
Package Description:    QFN-D 8EP 4SQ*1.0P0.8


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame  CDA 194 + NIPDAU  RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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