NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCF5282CVF66
Package Description:    MAPBGA 256 17*17*0.8P1.0
Tracking Number:   K00022D091


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request