NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCF5329CVM240
Package Description:    MAPBGA 256 17*17*0.8P1.0
Tracking Number:   K00022D026


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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