NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCF5475ZP266
Package Description:
PBGA 388 27*27*1.25P1.0
Tracking Number:
K00033D062
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
E-679FGB
RoHS CoA
AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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