NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX31CJKN5D
Package Description:    26*26 GRID
Tracking Number:   K11140D009


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGBM  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request