NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCIMX508CZK8B
Package Description:
416 POP BGA 13x13, 0.5mm
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate, Halogen-free
DS-7409HGB
RoHS CoA
AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
RoHS CoA
Questions or additional information on a RoHS CoA report, please enter a service request