Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
Die Encapsulant, Halogen-free |
|
RoHS CoA
|
Organic Substrate, Halogen-free |
E679FGB |
RoHS CoA
|
Silicon Semiconductor Die |
LEAD FREE BUMP |
RoHS CoA
|
|
FAB 14 |
RoHS CoA
|
Solder Balls - Lead Free |
|
RoHS CoA
|
Underfill |
|
RoHS CoA
|