NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCIMX6G0DVM05AB
Package Description:
MAP289 14*14*1.4P.8T1.32
Tracking Number:
K00159D008
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Non-Conductive Epoxy/Adhesive
RoHS CoA
Organic Substrate
AUS 308
RoHS CoA
COPPER
RoHS CoA
E679FGBM
RoHS CoA
Silicon Semiconductor Die
LEAD FREE BUMP
RoHS CoA
FAB 14
RoHS CoA
Solder Balls - Pb Free, Sn/Ag
RoHS CoA
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