NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6G0DVM05ABR


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  COPPER  RoHS CoA
  AUS 308  RoHS CoA
  E679FGBM  RoHS CoA
Silicon Semiconductor Die  FAB 14  RoHS CoA
  LEAD FREE BUMP  RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request