NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6G2CVK05AB
Package Description:    MAPBGA 272 9*9*1.23 P0.5
Tracking Number:   K00159D009


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  E679FGBM  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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