Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
Bonding Wire, PdCu |
|
RoHS CoA
|
Die Encapsulant, Halogen-free |
|
RoHS CoA
|
Non-Conductive Epoxy/Adhesive |
|
RoHS CoA
|
Organic Substrate, Halogen-free |
HL-832NXA |
RoHS CoA
|
|
AUS 308 |
RoHS CoA
|
Silicon Semiconductor Die |
FAB 14 |
RoHS CoA
|
|
LEAD FREE BUMP |
RoHS CoA
|
Solder Balls - Lead Free |
|
RoHS CoA
|