NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6Q7CVT08AE
Package Description:    FC-PBGA 624 21*21*2 P0.8
Tracking Number:   K00226D002


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Cap/Cover    RoHS CoA
Gel Die Encapsulant    RoHS CoA
Organic Substrate  E679FGR  RoHS CoA
  AUS 703  RoHS CoA
  PHP-900 IR6  RoHS CoA
  GX13  RoHS CoA
  COPPER  RoHS CoA
Silicon Semiconductor Die  FAB 14  RoHS CoA
  LEAD FREE BUMP  RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request