NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCIMX6Q7CVT08AE
Package Description:
FC-PBGA 624 21*21*2 P0.8
Tracking Number:
K00226D002
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Agent
RoHS CoA
Cap/Cover
RoHS CoA
Gel Die Encapsulant
RoHS CoA
Organic Substrate
GX13
RoHS CoA
E679FGR
RoHS CoA
AUS 703
RoHS CoA
COPPER
RoHS CoA
PHP-900 IR6
RoHS CoA
Silicon Semiconductor Die
FAB 14
RoHS CoA
LEAD FREE BUMP
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
Underfill
RoHS CoA
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