NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6Q7CZK08AD
Package Description:    569 FCCSP PoP 12mm
Tracking Number:   K50008S327


Subcomponent Description Homogeneous Material Identification RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Organic Substrate, Halogen-free  E679FGB  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


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