NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6X2AVN08AB
Package Description:    20*20 GRID STD
Tracking Number:   K50001S535


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  COPPER FOIL  RoHS CoA
  AUS 308  RoHS CoA
  HL-832NXA HS  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request