NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6X2EVN10AC
Package Description:    MAPBGA 400 17*17*0.8P0.8
Tracking Number:   K50001S535


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  HL-832NXA HS  RoHS CoA
  AUS 308  RoHS CoA
  COPPER FOIL  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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