NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCIMX6X4AVM08ABR
Package Description:
529 19x19 MAP
Tracking Number:
K50001S529
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Non-Conductive Epoxy/Adhesive
RoHS CoA
Organic Substrate, Halogen-free
DS-7409HGB
RoHS CoA
COPPER FOIL
RoHS CoA
AUS 703
RoHS CoA
Silicon Semiconductor Die
FAB 14
RoHS CoA
LEAD FREE BUMP
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
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