NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6X4EVM10AB
Package Description:    529 19x19 MAP
Tracking Number:   K50001S529


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  DS-7409HGB  RoHS CoA
  AUS 703  RoHS CoA
  COPPER FOIL  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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