NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCZ33904B3EK
Package Description:
EXPOSED PAD 4.7*4.7MM
Tracking Number:
K10945D006
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Copper Lead Frame
AG SPOT PLATE
RoHS CoA
CDA 194
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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