NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK11DN512AVMC5
Package Description:    11*11 STD GRID
Tracking Number:   K00195D004


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  AUS 308  RoHS CoA
  E679FGB  RoHS CoA
  CU FOIL  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request