NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MK20DN32VFM5
Package Description:
EXPOSED PAD 3.8*3.8
Tracking Number:
K00229D006
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Copper Lead Frame
RoHS CoA
AG PLATING
RoHS CoA
C194
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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