NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK20DN64VFM5
Package Description:    EXPOSED PAD 3.8*3.8
Tracking Number:   K00229D006


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame  AG PLATING  RoHS CoA
  C194  RoHS CoA
    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request