NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK30DX256ZVLQ10
Package Description:    FREE 1.0F JEDEC/EIAJ
Tracking Number:   K00023D139


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request