NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK51DN256CMD10
Tracking Number:   K00169D005


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate, Halogen-free  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


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