NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK51DX256CLK10
Package Description:    FREE 1.0F CU JEDEC
Tracking Number:   K50001S028


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request