NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK60DN256ZVLQ10
Package Description:    LQFP 144 20SQ1.4P0.5 C90
Tracking Number:   K50001S032


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper  null  RoHS CoA
Copper Lead Frame  null  RoHS CoA
Die Encapsulant, Halogen-free  null  RoHS CoA
Epoxy Die Attach  null  RoHS CoA
Lead Frame Plating  null  RoHS CoA
Silicon Semiconductor Die  null  RoHS CoA


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