NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK60DN512VLQ10
Package Description:    LQFP 144 20SQ1.4P0.5 C90
Tracking Number:   K00023D139


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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