NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MK65FN2M0VMI18R


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FG  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request