NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MKW21D256VHA5
Package Description:    8*8 63MAPLGA


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die  FAB 3  RoHS CoA
    RoHS CoA


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