NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MM908E622ACPEK
Package Description:    EXPOSED PAD 5.1X10.8MM
Tracking Number:   K10849D011


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
High Pb Sn/Ti/W Bumps    RoHS CoA
    RoHS CoA
Lead Frame Plating    RoHS CoA


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