NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MM908E622ACPEKR2
Package Description:
EXPOSED PAD 5.1X10.8MM
Tracking Number:
K10849D011
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
High Pb Sn/Ti/W Bumps
RoHS CoA
RoHS CoA
Lead Frame Plating
RoHS CoA
Questions or additional information on a RoHS CoA report, please enter a service request