NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MMPF0200F3AEP
Package Description:    8x8 56 QFN
Tracking Number:   K50010S281


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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