NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC5123YVY400B
Package Description:    PBGA-PGE 516 27SQ1.25P1
Tracking Number:   K11245D021


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Heat Spreader    RoHS CoA
Lead Frame Assembly  BT MCL-E-679FGB  RoHS CoA
  SOLDER MASK AUS308  RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request