NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC5125YVN400
Package Description:    22*22 GRID PGE


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  AUS 308  RoHS CoA
  E679FGB  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Pb Free, Sn/Ag    RoHS CoA


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