NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC5200BV400
Package Description:
PBGA 272 27*27*1.25P1.27
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
E679FGB
RoHS CoA
AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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