NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC5534MZQ80
Package Description:    PBGAPGE 324 23SQ1.25P1.0
Tracking Number:   K00073D018


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS 308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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