NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC5534MZQ80
Package Description:
PBGAPGE 324 23SQ1.25P1.0
Tracking Number:
K00073D018
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
AUS 308
RoHS CoA
E679FGB
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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