NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC5553MZP80
Package Description:
26*26 GRID 4OUTR 8INNR
Tracking Number:
K10908D054
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
BT MCL-E-679FGB
RoHS CoA
SOLDER MASK AUS308
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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