NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC5554MZP132
Package Description:    PBGA 416 27*27*1.25P1.0


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  E679FGB  RoHS CoA
  AUS308  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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