NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC5566MZP144
Package Description:    26*26 GRID 4OUTR 8INNR
Tracking Number:   K10908D014


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  AUS308  RoHS CoA
  E679FGB  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request