NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MPC563MZP56R2
Package Description:
PBGA 388 27*27*1.25P1.0
Tracking Number:
K00033D033
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate
SOLDER MASK AUS7
RoHS CoA
BT CCL-HL832
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Low Lead
RoHS CoA
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