NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC566AZP56
Package Description:    PBGA 388 27*27*1.25P1.0
Tracking Number:   K00033D060


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  BT CCL-HL832  RoHS CoA
  SOLDER MASK AUS7  RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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