NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MPC8250ACZQIHBC
Package Description:    PBGA 516 27*27*1.25P1.0
Tracking Number:   K10774D015


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate  AUS308  RoHS CoA
  HL-832  RoHS CoA
Silicon Semiconductor Die  HIP4D/P  RoHS CoA
Solder Balls - Low Lead    RoHS CoA


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